Auburn to host NextFlex workshop in aerospace and automotive electronics in Huntsville
Published: Sep 26, 2025 11:00 AM
By Jeremy Henderson
In the world of flexible hybrid electronics (FHE), few universities can flex like Auburn. And next month, they're taking the show on the road.
On October 14-16, Auburn University will host the NextFlex Workshop on Automotive and Aerospace Flexible Hybrid Electronics at the university's Applied Research Institute in Huntsville. Auburn University is a tier-1 founding member of NextFlex, an FHE-focused Department of Defense Manufacturing Innovation Institute. Convening experts from industry as well as federal agencies that operate in Alabama, the workshop will explore advancements in the fabrication of additively manufactured (AM) electronics, as well as their application in sectors with deep roots in the state — automotive and aerospace.
In addition to technical presentations, the event will provide an opportunity for attendees to meet with manufacturers working throughout the various tiers of the additive fabrication ecosystem.
“Electronics have traditionally been fabricated using subtractive methods," said Pradeep Lall, the MacFarlane Distinguished Professor and Alumni Professor in the Department of Mechanical Engineering. “The subtractive process involves starting with copper-plated substrates and removing the parts that are not needed to achieve functional circuits. Significant gains can be achieved in reducing the amount of materials used, reducing production costs, and achieving closer integration of form and function using additive methods to create functional products.”
Lall will co-chair the workshop with John Williams, technical fellow at Boeing Research and Technology.
“Hybrid electronics are transforming the automotive and aerospace industries by enabling sophisticated, lightweight and highly efficient systems that enhance both performance and safety," Lall said. 'From touch control human-machine interfaces and advanced driver-assistance systems to cutting-edge avionics, hybrid electronics are leading the charge in technological innovation. These advancements have paved the way for the electrification of automotive and aerospace platforms, giving rise to ground and airborne electric vehicles that offer improved fuel efficiency and reduced emissions."
Its wealth of experience in FHE and the design of electronics for operation in harsh environments recently led to the Samuel Ginn College of Engineering to establish the Auburn University Electronics Packaging Institute (EPRI), which Lall directs.
Lall, who also leads two of NextFlex's technical working groups on automotive electronics and asset monitoring, is one of the nation's most vocal proponents of applying AM technology to onshoring electronics for national security. He was named a NextFlex Fellow in 2019 and received the SEMI Flexi R&D Achievement Award in 2023 for landmark contributions to the development of additive manufacturing processes and reliability testing for additive printed flexible electronics.
"With the increased emphasis on domestic manufacturing of electronics, including advanced electronics technologies, the use of additive methods provides unique opportunities," Lall said. "Auburn has been working for over a decade on the technology maturation of a number of additive print platforms for high-volume production. And now, through EPRI, and through the continued close collaboration with NextFlex that is making this workshop possible, we're better positioned to help FHE achieve the sort of integration necessary for even greater technological innovations."
Pradeep Lall, director of the Auburn University Electronics Packaging Research Institute, displays additive in-mold electronics for automotive applications fabricated on the gravure offset platform.
